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W25Q128JVEIM TR

W25Q128JVEIM TR

  • 厂商:

    WINBOND(华邦)

  • 封装:

    WDFN8

  • 描述:

    IC FLASH 128MBIT SPI/QUAD 8WSON

  • 详情介绍
  • 数据手册
  • 价格&库存
W25Q128JVEIM TR 数据手册
W25Q128JV-DTR 3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI & DTR For Industrial & Industrial Plus Grade Publication Release Date: March 02, 2018 -Revision C W25Q128JV-DTR Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS........................................................................... 6 4. 3.1 Pin Configuration SOIC 208-mil ........................................................................................... 6 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm ...................................................................... 6 3.3 Pin Description SOIC 208-mil, WSON 6x5-mm / 8x6-mm ................................................... 6 3.4 Pin Configuration SOIC 300-mil ........................................................................................... 7 3.5 Pin Description SOIC 300-mil ............................................................................................... 7 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8 3.7 Ball Description TFBGA 8x6-mm ......................................................................................... 8 PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) .................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 9 4.3 Write Protect (/WP) .............................................................................................................. 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 4.6 Reset (/RESET) .................................................................................................................... 9 5. BLOCK DIAGRAM .......................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11 6.1 6.2 SPI / QPI Operations .......................................................................................................... 11 6.1.1 Standard SPI Instructions ..................................................................................................... 11 6.1.2 Dual SPI Instructions ............................................................................................................ 11 6.1.3 Quad SPI Instructions ........................................................................................................... 12 6.1.4 QPI Instructions .................................................................................................................... 12 6.1.5 SPI / QPI DTR Read Instructions ......................................................................................... 12 6.1.6 Hold Function ....................................................................................................................... 12 6.1.7 Software Reset & Hardware /RESET pin .............................................................................. 13 Write Protection .................................................................................................................. 14 6.2.1 7. Write Protect Features ......................................................................................................... 14 STATUS AND CONFIGURATION REGISTERS ............................................................................ 15 7.1 Status Registers ................................................................................................................. 15 7.1.1 Erase/Write In Progress (BUSY) – Status Only ................................................................ 15 7.1.2 Write Enable Latch (WEL) – Status Only .......................................................................... 15 7.1.3 Block Protect Bits (BP2, BP1, BP0) – Volatile/Non-Volatile Writable ................................ 15 W25Q128JV-DTR 8. 7.1.4 Top/Bottom Block Protect (TB) – Volatile/Non-Volatile Writable ....................................... 16 7.1.5 Sector/Block Protect Bit (SEC) – Volatile/Non-Volatile Writable ....................................... 16 7.1.6 Complement Protect (CMP) – Volatile/Non-Volatile Writable ............................................ 16 7.1.7 Status Status Register Protect Protect (SRP, SRL) ............................................................. 17 7.1.8 Erase/Program Suspend Status (SUS) – Status Only......................................................... 0 7.1.9 Security Register Lock Bits (LB3, LB2, LB1) – Volatile/Non-Volatile OTP Writable ............ 0 7.1.10 Quad Enable (QE) – Volatile/Non-Volatile Writable .......................................................... 0 7.1.11 Write Protect Selection (WPS) – Volatile/Non-Volatile Writable ..................................... 19 7.1.12 Output Driver Strength (DRV1, DRV0) – Volatile/Non-Volatile Writable ......................... 19 7.1.13 /HOLD or /RESET Pin Function (HOLD/RST) – Volatile/Non-Volatile Writable .............. 19 7.1.14 Reserved Bits – Non Functional ...................................................................................... 20 7.1.15 W25Q128JV Status Register Memory Protection (WPS = 0, CMP = 0) ............................. 21 7.1.16 W25Q128JV Status Register Memory Protection (WPS = 0, CMP = 1) ............................. 22 7.1.17 W25Q128JV Individual Block Memory Protection (WPS=1) .............................................. 23 INSTRUCTIONS ............................................................................................................................. 24 8.1 8.2 Device ID and Instruction Set Tables ................................................................................. 24 8.1.1 Manufacturer and Device Identification ................................................................................ 24 8.1.2 Instruction Set Table 1 (Standard SPI Instructions) (1)........................................................... 25 8.1.3 Instruction Set Table 2 (Dual/Quad SPI Instructions) ........................................................... 26 8.1.4 Instruction Set Table 3 (QPI Instructions)(11) ........................................................................ 27 8.1.5 Instruction Set Table 4 (DTR with SPI Instructions) ............................................................. 28 8.1.6 Instruction Set Table 5 (DTR with QPI Instructions) ............................................................. 28 Instruction Descriptions ...................................................................................................... 30 8.2.1 Write Enable (06h) ............................................................................................................... 30 8.2.2 Write Enable for Volatile Status Register (50h) .................................................................... 30 8.2.3 Write Disable (04h) ............................................................................................................... 31 8.2.4 Read Status Register-1 (05h), Status Register-2 (35h) & Status Register-3 (15h) .............. 32 8.2.5 Write Status Register-1 (01h), Status Register-2 (31h) & Status Register-3 (11h) .............. 33 8.2.6 Read Data (03h) ................................................................................................................... 35 8.2.7 Fast Read (0Bh) ................................................................................................................... 36 8.2.8 DTR Fast Read (0Dh) ........................................................................................................... 38 8.2.9 Fast Read Dual Output (3Bh) ............................................................................................... 40 8.2.10 Fast Read Quad Output (6Bh) ............................................................................................ 41 8.2.11 Fast Read Dual I/O (BBh) ................................................................................................... 42 8.2.12 DTR Fast Read Dual I/O (BDh) .......................................................................................... 44 8.2.13 Fast Read Quad I/O (EBh) ................................................................................................. 46 8.2.14 DTR Fast Read Quad I/O (EDh) ......................................................................................... 48 8.2.15 Set Burst with Wrap (77h) .................................................................................................. 52 8.2.16 Page Program (02h) ........................................................................................................... 53 8.2.17 Quad Input Page Program (32h) ........................................................................................ 55 -2- Publication Release Date: March 27, 2018 -Revision C W25Q128JV-DTR 9. 10. 8.2.18 Sector Erase (20h) ............................................................................................................. 56 8.2.19 32KB Block Erase (52h) ..................................................................................................... 57 8.2.20 64KB Block Erase (D8h) ..................................................................................................... 58 8.2.21 Chip Erase (C7h / 60h) ....................................................................................................... 59 8.2.22 Erase / Program Suspend (75h) ......................................................................................... 60 8.2.23 Erase / Program Resume (7Ah) ......................................................................................... 62 8.2.24 Power-down (B9h) .............................................................................................................. 63 8.2.25 Release Power-down / Device ID (ABh) ............................................................................. 64 8.2.26 Read Manufacturer / Device ID (90h) ................................................................................. 66 8.2.27 Read Manufacturer / Device ID Dual I/O (92h) ................................................................... 67 8.2.28 Read Manufacturer / Device ID Quad I/O (94h) ................................................................. 68 8.2.29 Read Unique ID Number (4Bh)........................................................................................... 69 8.2.30 Read JEDEC ID (9Fh) ........................................................................................................ 70 8.2.31 Erase Security Registers (44h) ........................................................................................... 71 8.2.32 Read SFDP Register (5Ah) ................................................................................................ 72 8.2.33 Program Security Registers (42h) ...................................................................................... 73 8.2.34 Read Security Registers (48h) ........................................................................................... 74 8.2.35 Set Read Parameters (C0h) ............................................................................................... 75 8.2.36 Burst Read with Wrap (0Ch)............................................................................................... 76 8.2.37 DTR Burst Read with Wrap (0Eh) ...................................................................................... 77 8.2.38 Enter QPI Mode (38h)......................................................................................................... 78 8.2.39 Exit QPI Mode (FFh) ........................................................................................................... 79 8.2.40 Individual Block/Sector Lock (36h) ..................................................................................... 80 8.2.41 Individual Block/Sector Unlock (39h) .................................................................................. 81 8.2.42 Read Block/Sector Lock (3Dh) ........................................................................................... 82 8.2.43 Global Block/Sector Lock (7Eh) .......................................................................................... 83 8.2.44 Global Block/Sector Unlock (98h) ....................................................................................... 83 8.2.45 Enable Reset (66h) and Reset Device (99h) ...................................................................... 84 ELECTRICAL CHARACTERISTICS ............................................................................................... 85 9.1 Absolute Maximum Ratings (1) ............................................................................................ 85 9.2 Operating Ranges............................................................................................................... 85 9.3 Power-Up Power-Down Timing and Requirements ............................................................ 86 9.4 DC Electrical Characteristics- ............................................................................................. 87 9.5 AC Measurement Conditions .............................................................................................. 88 9.6 AC Electrical Characteristics(6) ........................................................................................... 89 9.7 Serial Output Timing ........................................................................................................... 91 9.8 Serial Input Timing .............................................................................................................. 91 9.9 /HOLD Timing ..................................................................................................................... 91 9.10 /WP Timing ......................................................................................................................... 91 PACKAGE SPECIFICATIONS ........................................................................................................ 92 W25Q128JV-DTR 11. 10.1 8-Pin SOIC 208-mil (Package Code S) .............................................................................. 92 10.2 8-Pad WSON 6x5-mm (Package Code P) ......................................................................... 93 10.3 8-Pad WSON 8x6-mm (Package Code E) ......................................................................... 94 10.4 16-Pin SOIC 300-mil (Package Code F) ............................................................................ 95 10.5 24-Ball TFBGA 8x6-mm (Package Code B, 5x5-1 ball array) ............................................ 96 10.6 24-Ball TFBGA 8x6-mm (Package Code C, 6x4 ball array) ............................................... 97 ORDERING INFORMATION .......................................................................................................... 98 11.1 12. Valid Part Numbers and Top Side Marking ........................................................................ 99 REVISION HISTORY .................................................................................................................... 100 -4- Publication Release Date: March 27, 2018 -Revision C W25Q128JV-DTR 1. GENERAL DESCRIPTIONS The W25Q128JV (128M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 1µA for power-down. All devices are offered in space-saving packages. The W25Q128JV array is organized into 65,536 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q128JV has 4,096 erasable sectors and 256 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See Figure 2.) The W25Q128JV support the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI Quad Peripheral Interface (QPI) as well as Double Transfer Rate(DTR) : Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 133MHz are supported allowing equivalent clock rates of 266MHz (133MHz x 2) for Dual I/O and 532MHz (133MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O and QPI instructions. These 3transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (execute in place) operation. A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device ID, a 64-bit Unique Serial Number and three 256-bytes Security Registers. 2. FEATURES – -40°C to +85°C operating range – -40°C to +105°C operating range  New Family of SpiFlash Memories – W25Q128JV: 128M-bit / 16M-byte – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – QPI: CLK, /CS, IO0, IO1, IO2, IO3 – SPI/QPI DTR(Double Transfer Rate) Read – Software & Hardware Reset(1)  Highest Performance Serial Flash – 133MHz Single, Dual/Quad SPI clocks – 266/532MHz equivalent Dual/Quad SPI – 66MB/S continuous data transfer rate – Min. 100K Program-Erase cycles per sector – More than 20-year data retention  Efficient “Continuous Read” and QPI Mode – Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Quad Peripheral Interface (QPI) reduces instruction overhead – Allows true XIP (execute in place) operation  Low Power, Wide Temperature Range – Single 2.7 to 3.6V supply –
W25Q128JVEIM TR
PDF文档的物料型号为:MP2315。

器件简介:MP2315 是一款高性能的同步降压 DC/DC 转换器。

引脚分配:1-GND,2-VIN,3-EN,4-SW,5-VOUT,6-FB,7-PG,8-PAD。

参数特性:输入电压范围:4.5V至36V;输出电压范围:0.63V至24V;最大输出电流:3A;效率高达93%。

功能详解:具有软启动功能,可编程的软启动时间;可编程的输出电压;可编程的输出电流限制;过热保护;输入欠压锁定;输出短路保护。

应用信息:广泛适用于便携式电子设备、电池供电设备、LED照明等。

封装信息:TSSOP-8。
W25Q128JVEIM TR 价格&库存

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W25Q128JVEIM TR
  •  国内价格 香港价格
  • 1+17.269741+2.07409
  • 10+15.3306410+1.84121
  • 25+14.6188625+1.75572
  • 50+14.1041950+1.69391
  • 100+13.60624100+1.63411
  • 250+12.97407250+1.55818
  • 500+12.51538500+1.50309
  • 1000+12.072291000+1.44988

库存:3411

W25Q128JVEIM TR
  •  国内价格 香港价格
  • 4000+11.231594000+1.34891
  • 8000+10.832678000+1.30100

库存:3411